Low pressur plasma replaces wet chemical treatment

Plasma is known as the fourth state of matter. In low pressure plasma technology a stable and effective plasma is created by an electromagnetic discharge of a gas at low pressure and low temperature. The plasma interacts with the surface of the substrate without changing the bulk properties of the material.

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		Typical applications Removal of organic residue and oxidation prior to soldering and wire bonding on copper, silver, gold, .. tracks Cleaning of electronic circuitry prior to encapsulation, gluing, printing, wire bonding, soldering Dry cleaning to replace chemical degreasing, such as Trichloroethylene. Cleaning prior to: Flocking Bonding Painting Gluing Why using plasma? Dry and clean process Very effective treatment! Clean room compatible equipment Simple process control Uniform treatment of complex three dimensional structures 100% controlled processing environment Low variable costs Batch process easily integrated in production line